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Package characteristics ST72321xx-Auto
222/243 Doc ID 13829 Rev 1
20.1 Thermal characteristics
20.2 Ecopack information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
20.3 Packaging for automatic handling
The devices can be supplied in trays or with tape and reel conditioning.
Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when
facing the tape sprocket holes as shown in Figure 104.
Figure 104. Pin 1 orientation in tape and reel conditioning
See also Section Figure 105.: ST72F321xxx-Auto Flash commercial product structure on
page 226 and Figure 106: ST72P321xxx-Auto FastROM commercial product structure on
page 228.
Table 139. Thermal characteristics
Symbol Ratings Value Unit
R
thJA
Package thermal resistance (junction to ambient)
LQFP64 14x14
LQFP64 10x10
LQFP44 10x10
47
50
52
°C/W
P
D
Power dissipation
(1)
1. The maximum power dissipation is obtained from the formula P
D
= (T
J
-T
A
) / R
thJA
. The power dissipation
of an application can be defined by the user with the formula: P
D
=P
INT
+P
PORT
where P
INT
is the chip
internal power (I
DD
xV
DD
) and P
PORT
is the port power dissipation depending on the ports used in the
application.
500 mW
T
Jmax
Maximum junction temperature
(2)
2. The maximum chip-junction temperature is based on technology characteristics.
150 °C
Right orientation (EIA 481-C compliant)
Left orientation
Pin 1
Pin 1
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